ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,013, issued on June 23, was assigned to FOSHAN NATIONSTAR OPTOELECTRONICS Co. LTD. (Foshan, China). "Device including a chipset and an anti... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,014, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Package structure and packaging method" was... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,015, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device with pairs of signal pads concentrated on ... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,016, issued on June 23, was assigned to Hue Inc. (Shanghai). "Micro package structure" was invented by Yang Yue (Shanghai). According to t... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,017, issued on June 23, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting device module and display apparat... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,018, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including mult... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,019, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Hongj... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,020, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Hybrid underfill structures for mul... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,021, issued on June 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method for manufacturing semiconductor module" was inven... और पढ़ें
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,022, issued on June 23, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Complex system-in-package architectures leveraging high-bandwi... और पढ़ें